XC7VX330T-3FFG1761E

芯片详细信息

Manufacturer Part Number:

XC7VX330T-3FFG1761E

Pbfree Code:

 Yes

Rohs Code:

 Yes

Part Life Cycle Code:

Active

Ihs Manufacturer:

XILINX INC

Part Package Code:

BGA

Package Description:

FBGA-1761

Pin Count:

1761

Reach Compliance Code:

compliant

ECCN Code:

3A991.D

HTS Code:

8542.39.00.01

Factory Lead Time:

12 Weeks

Manufacturer:

Xilinx

Risk Rank:

5.8

Clock Frequency-Max:

1818 MHz

Combinatorial Delay of a CLB-Max:

0.58 ns

JESD-30 Code:

S-PBGA-B1761

JESD-609 Code:

e1

Length:

42.5 mm

Moisture Sensitivity Level:

4

Number of CLBs:

25500

Number of Inputs:

650

Number of Logic Cells:

326400

Number of Outputs:

650

Number of Terminals:

1761

Organization:

25500 CLBS

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA1924,44X44,40

Package Shape:

SQUARE

Package Style:

GRID ARRAY

Peak Reflow Temperature (Cel):

NOT SPECIFIED

Power Supplies:

1,1.8 V

Programmable Logic Type:

FIELD PROGRAMMABLE GATE ARRAY

Qualification Status:

Not Qualified

Seated Height-Max:

3.5 mm

Subcategory:

Field Programmable Gate Arrays

Supply Voltage-Max:

1.03 V

Supply Voltage-Min:

0.97 V

Supply Voltage-Nom:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Time@Peak Reflow Temperature-Max (s):

NOT SPECIFIED

Width:

42.5 mm