XC7VX330T-3FFV1761E

XC7VX330T-3FFV1761E


芯片详细信息


Manufacturer Part Number:


XC7VX330T-3FFV1761E


Rohs Code:


 Yes


Part Life Cycle Code:


Active


Ihs Manufacturer:


XILINX INC


Package Description:


BGA,


Reach Compliance Code:


compliant


ECCN Code:


3A991.D


HTS Code:


8542.39.00.01


Manufacturer:


Xilinx


Risk Rank:


5.82


Combinatorial Delay of a CLB-Max:


0.58 ns


JESD-30 Code:


S-PBGA-B1761


JESD-609 Code:


e1


Length:


42.5 mm


Number of CLBs:


25500


Number of Terminals:


1761


Organization:


25500 CLBS


Package Body Material:


PLASTIC/EPOXY


Package Code:


BGA


Package Shape:


SQUARE


Package Style:


GRID ARRAY


Peak Reflow Temperature (Cel):


NOT SPECIFIED


Programmable Logic Type:


FIELD PROGRAMMABLE GATE ARRAY


Seated Height-Max:


3.77 mm


Supply Voltage-Max:


1.03 V


Supply Voltage-Min:


0.97 V


Supply Voltage-Nom:


1 V


Surface Mount:


YES


Terminal Finish:


Tin/Silver/Copper (Sn/Ag/Cu)


Terminal Form:


BALL


Terminal Pitch:


1 mm


Terminal Position:


BOTTOM


Time@Peak Reflow Temperature-Max (s):


NOT SPECIFIED


Width:


42.5 mm


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