服务热线
400-999-4131
XC7VX330T-3FFV1761E
芯片详细信息
Manufacturer Part Number:
XC7VX330T-3FFV1761E
Rohs Code:
Yes
Part Life Cycle Code:
Active
Ihs Manufacturer:
XILINX INC
Package Description:
BGA,
Reach Compliance Code:
compliant
ECCN Code:
3A991.D
HTS Code:
8542.39.00.01
Manufacturer:
Xilinx
Risk Rank:
5.82
Combinatorial Delay of a CLB-Max:
0.58 ns
JESD-30 Code:
S-PBGA-B1761
JESD-609 Code:
e1
Length:
42.5 mm
Number of CLBs:
25500
Number of Terminals:
1761
Organization:
25500 CLBS
Package Body Material:
PLASTIC/EPOXY
Package Code:
BGA
Package Shape:
SQUARE
Package Style:
GRID ARRAY
Peak Reflow Temperature (Cel):
NOT SPECIFIED
Programmable Logic Type:
FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max:
3.77 mm
Supply Voltage-Max:
1.03 V
Supply Voltage-Min:
0.97 V
Supply Voltage-Nom:
1 V
Surface Mount:
YES
Terminal Finish:
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form:
BALL
Terminal Pitch:
1 mm
Terminal Position:
BOTTOM
Time@Peak Reflow Temperature-Max (s):
NOT SPECIFIED
Width:
42.5 mm